Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | 87587-2059 |
|---|---|
| Manufacturer: | Molex, LLC |
| Product Category: | Memory Connectors - Inline Module Sockets |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | 168 Position DIMM DRAM Socket Through Hole, 25° Angle |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | Obsolete / Discontinued |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | 87587-2059 Datasheet |
| Internal Part Number | 898-87587-2059 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| 3D Model | 87587-2059.stp | |
| PCN Obsolescence/ EOL | 87587 Series 19/Jan/2012 | |
| PCN Design/Specification | Multiple Devices 13/Nov/2015 | |
| Category | Connectors, Interconnects | |
| Family | Memory Connectors - Inline Module Sockets | |
| Manufacturer | Molex Connector Corporation | |
| Series | 87587 | |
| Packaging | Tray | |
| Part Status | Obsolete | |
| Connector Style | DIMM | |
| Number of Positions | 168 | |
| Memory Type | DRAM | |
| Standards | MO-161 | |
| Mounting Type | Through Hole, 25° Angle | |
| Features | Board Guide, Board Lock, Latches | |
| Mounting Feature | Normal, Standard - Top | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 15µin (0.38µm) | |
| Standard Package | 1 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | 87587-2059 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
87587-2059 is in stock for immediate shipping now. We are the distributor of Molex, LLC all series components. The condition of 87587-2059 is new and unused, you can buy 87587-2059 Molex, LLC with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 87587-2059.
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