Manufacturer Part Number: | 6V31023PGG |
---|---|
Manufacturer: | IDT, Integrated Device Technology Inc |
Product Category: | Clock/Timing - Application Specific |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | IC CLK BUFFER 2:1 167MHZ 16TSSOP |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | 6V31023PGG Datasheet |
Internal Part Number | 898-6V31023PGG | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Assembly/Origin | TSSOP/VFQFPN Assembly Site/Part Marking Chg 13/Nov/2015 Alt. Assembly Site 15/Feb/2016 Alternate Assembly Facility 14/Apr/2016 | |
Category | Integrated Circuits (ICs) | |
Family | Clock/Timing - Application Specific | |
Manufacturer | IDT, Integrated Device Technology Inc | |
Series | - | |
Packaging | Tube | |
Part Status | Active | |
PLL | No | |
Main Purpose | PCI Express (PCIe) | |
Input | HCSL | |
Output | HCSL, LVDS | |
Number of Circuits | 1 | |
Ratio - Input:Output | 2:1 | |
Differential - Input:Output | Yes/Yes | |
Frequency - Max | 200MHz | |
Voltage - Supply | 3.3V | |
Operating Temperature | 0°C ~ 70°C | |
Mounting Type | Surface Mount | |
Package / Case | 16-TSSOP (0.173", 4.40mm Width) | |
Supplier Device Package | 16-TSSOP | |
Standard Package | 96 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | 6V31023PGG | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
6V31023PGG is in stock for immediate shipping now. We are the distributor of IDT, Integrated Device Technology Inc all series components. The condition of 6V31023PGG is new and unused, you can buy 6V31023PGG IDT, Integrated Device Technology Inc with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 6V31023PGG.
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