Stocking distributor of Electronic Components
Email: [email protected]
| Manufacturer Part Number: | 520-AG12D-LF |
|---|---|
| Manufacturer: | TE Connectivity Potter & Brumfield Relays |
| Product Category: | Sockets for ICs, Transistors |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | CONN IC DIP SOCKET 20POS TIN |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | 520-AG12D-LF Datasheet |
| Internal Part Number | 898-520-AG12D-LF | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| RoHS Information | 1571550-6 Statement of Compliance RoHS 2 Statement | |
| 3D Model | 1571550-6.pdf | |
| Category | Connectors, Interconnects | |
| Family | Sockets for ICs, Transistors | |
| Manufacturer | TE Connectivity AMP Connectors | |
| Series | 500 | |
| Packaging | Tube | |
| Part Status | Active | |
| Type | DIP, 0.3" (7.62mm) Row Spacing | |
| Number of Positions or Pins (Grid) | 20 (2 x 10) | |
| Pitch - Mating | 0.100" (2.54mm) | |
| Contact Finish - Mating | Tin | |
| Contact Finish Thickness - Mating | - | |
| Contact Material - Mating | Beryllium Copper | |
| Mounting Type | Through Hole | |
| Features | Closed Frame | |
| Termination | Solder | |
| Pitch - Post | 0.100" (2.54mm) | |
| Contact Finish - Post | Tin | |
| Contact Finish Thickness - Post | - | |
| Contact Material - Post | Beryllium Copper | |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
| Operating Temperature | -55°C ~ 105°C | |
| Termination Post Length | 0.125" (3.18mm) | |
| Material Flammability Rating | UL94 V-0 | |
| Current Rating | - | |
| Contact Resistance | 10 mOhm | |
| Standard Package | 480 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | 520-AG12D-LF | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
520-AG12D-LF is in stock for immediate shipping now. We are the distributor of TE Connectivity Potter & Brumfield Relays all series components. The condition of 520-AG12D-LF is new and unused, you can buy 520-AG12D-LF TE Connectivity Potter & Brumfield Relays with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 520-AG12D-LF.
| GCJ32DR72A225KA01L | 2.2µF 100V Ceramic Capacitor X7R 1210 (3225 Metric) 0.126" L x 0.098" W (3.20mm x 2.50mm) | GCJ32DR72A225KA01L.pdf | |
| CBR08C209B5GAC | 2pF 50V Ceramic Capacitor C0G, NP0 0805 (2012 Metric) 0.079" L x 0.049" W (2.00mm x 1.25mm) | CBR08C209B5GAC.pdf | |
| V56ZU8PX2855 | VARISTOR 56V 1KA DISC 14MM | V56ZU8PX2855.pdf | |
| EBM18DREF | CONN EDGECARD 36POS .156 EYELET | EBM18DREF.pdf | |
| GBB66DHNN-S621 | CONN EDGECARD 132POS .050 SOLDER | GBB66DHNN-S621.pdf | |
| BZT52H-C4V3,115 | Zener Diode 4.3V 375mW ±5% Surface Mount SOD-123F | BZT52H-C4V3,115.pdf | |
| ISC1210EB270K | 27µH Shielded Wirewound Inductor 125mA 3.3 Ohm Max 1210 (3225 Metric) | ISC1210EB270K.pdf | |
| LMK00301SQX/NOPB | Clock Fanout Buffer (Distribution), Multiplexer, Translator IC 3.1GHz 48-WFQFN Exposed Pad | LMK00301SQX/NOPB.pdf | |
| RER75F1152MC02 | RES CHAS MNT 11.5K OHM 1% 30W | RER75F1152MC02.pdf | |
| KJB0T23G21HC | 21 Position Circular Connector Receptacle, Male Pins Crimp Gold | KJB0T23G21HC.pdf | |
| SFV16R-3STE1HLF | 16 Position FPC Connector Contacts, Bottom 0.020" (0.50mm) Surface Mount, Right Angle | SFV16R-3STE1HLF.pdf | |
| 87139-510LF | 16 Positions Header, Shrouded Connector 0.079" (2.00mm) Through Hole Gold, GXT™ | 87139-510LF.pdf | |
| 430203-25-0 | 25 Circuit 0.438" (11.12mm) Barrier Block Connector, Screws | 430203-25-0.pdf | |
| RCL12181R05FKEK | RES SMD 1.05 OHM 1W 1812 WIDE | RCL12181R05FKEK.pdf |