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520-AG12D-LF

520-AG12D-LF
Manufacturer Part Number:520-AG12D-LF
Manufacturer:
Product Category:Sockets for ICs, Transistors
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:CONN IC DIP SOCKET 20POS TIN
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: 520-AG12D-LF Datasheet
520-AG12D-LF´s Parameters
Internal Part Number898-520-AG12D-LF
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
RoHS Information1571550-6 Statement of Compliance
RoHS 2 Statement
3D Model1571550-6.pdf
CategoryConnectors, Interconnects
FamilySockets for ICs, Transistors
ManufacturerTE Connectivity AMP Connectors
Series500
PackagingTube
Part StatusActive
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)20 (2 x 10)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingTin
Contact Finish Thickness - Mating-
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesClosed Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post-
Contact Material - PostBeryllium Copper
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature-55°C ~ 105°C
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
Current Rating-
Contact Resistance10 mOhm
Standard Package 480
Weight0.001 KG
ApplicationEmail for details
Replacement Part520-AG12D-LF
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

520-AG12D-LF is in stock for immediate shipping now. We are the distributor of TE Connectivity Potter & Brumfield Relays all series components. The condition of 520-AG12D-LF is new and unused, you can buy 520-AG12D-LF TE Connectivity Potter & Brumfield Relays with us at a very low price and quick delivery.

Please kindly send us an email if you have any demands for 520-AG12D-LF.

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