| Manufacturer Part Number: | 5015270230 |
|---|---|
| Manufacturer: | Molex, LLC |
| Product Category: | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | 20 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | 5015270230 Datasheet |
| Internal Part Number | 898-5015270230 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| 3D Model | 501527-0230.stp | |
| PCN Assembly/Origin | 501527yyyy Series Assembly Site 29/Aug.2014 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Manufacturer | Molex, LLC | |
| Series | SlimStack™ 501527 | |
| Packaging | Tape & Reel (TR) | |
| Part Status | Active | |
| Connector Type | Receptacle, Center Strip Contacts | |
| Number of Positions | 20 | |
| Pitch | 0.016" (0.40mm) | |
| Number of Rows | 2 | |
| Mounting Type | Surface Mount | |
| Features | Solder Retention | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 8µin (0.20µm) | |
| Mated Stacking Heights | 1.3mm | |
| Height Above Board | 0.048" (1.22mm) | |
| Standard Package | 6,000 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | 5015270230 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
5015270230 is in stock for immediate shipping now. We are the distributor of Molex, LLC all series components. The condition of 5015270230 is new and unused, you can buy 5015270230 Molex, LLC with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 5015270230.
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