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5-1437539-3

5-1437539-3
Manufacturer Part Number:5-1437539-3
Manufacturer:
Product Category:Sockets for ICs, Transistors
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:CONN IC DIP SOCKET 20POS GOLD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):Obsolete / Discontinued
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: 5-1437539-3 Datasheet
5-1437539-3´s Parameters
Internal Part Number898-5-1437539-3
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
RoHS Information5-1437539-3 Statement of Compliance
RoHS 2 Statement
3D Model5-1437539-3.pdf
EDA / CAD Models Download from Accelerated Designs
CategoryConnectors, Interconnects
FamilySockets for ICs, Transistors
ManufacturerTE Connectivity AMP Connectors
Series800
PackagingTube
Part StatusObsolete
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)20 (2 x 10)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating5µin (0.13µm)
Contact Material - MatingCopper Alloy
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - Post-
Contact Finish Thickness - Post-
Contact Material - Post-
Housing MaterialPolyester
Operating Temperature-55°C ~ 105°C
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
Current Rating3A
Contact Resistance10 mOhm
Standard Package 3,840
Weight0.001 KG
ApplicationEmail for details
Replacement Part5-1437539-3
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

5-1437539-3 is in stock for immediate shipping now. We are the distributor of TE Connectivity Potter & Brumfield Relays all series components. The condition of 5-1437539-3 is new and unused, you can buy 5-1437539-3 TE Connectivity Potter & Brumfield Relays with us at a very low price and quick delivery.

Please kindly send us an email if you have any demands for 5-1437539-3.

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