Manufacturer Part Number: | 322-HCS5P3-100LF |
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Manufacturer: | TE Connectivity Potter & Brumfield Relays |
Product Category: | Terminals - PC Pin Receptacles, Socket Connectors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | Pin Receptacle Connector No Tail Solder |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | 322-HCS5P3-100LF Datasheet |
Internal Part Number | 898-322-HCS5P3-100LF | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Connectors, Interconnects | |
Family | Terminals - PC Pin Receptacles, Socket Connectors | |
Manufacturer | TE Connectivity AMP Connectors | |
Series | HOLTITE | |
Packaging | Reel | |
Part Status | Active | |
Tail Type | No Tail | |
Termination | Solder | |
Length - Overall | 0.100" (2.54mm) | |
Accepts Pin Diameter | - | |
Mounting Hole Diameter | 0.044" (1.12mm) | |
Pin Hole Diameter | - | |
Flange Diameter | - | |
Tail Diameter | - | |
Socket Depth | - | |
Contact Material | Beryllium Copper | |
Contact Finish | Tin | |
Contact Finish Thickness | 80µin (2.03µm) | |
Features | - | |
Operating Temperature | -55°C ~ 125°C | |
Board Thickness | - | |
Insertion Force | 0.89Nm | |
Standard Package | 15,000 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | 322-HCS5P3-100LF | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
322-HCS5P3-100LF is in stock for immediate shipping now. We are the distributor of TE Connectivity Potter & Brumfield Relays all series components. The condition of 322-HCS5P3-100LF is new and unused, you can buy 322-HCS5P3-100LF TE Connectivity Potter & Brumfield Relays with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 322-HCS5P3-100LF.
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