Manufacturer Part Number: | 3-1470209-2 |
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Manufacturer: | TE Connectivity Potter & Brumfield Relays |
Product Category: | Rectangular - Board to Board Connectors - Headers, Receptacles, Female Sockets |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | 18 Position Receptacle Connector Gold 0.079" (2.00mm) Through Hole |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | Obsolete / Discontinued |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | 3-1470209-2 Datasheet |
Internal Part Number | 898-3-1470209-2 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Headers, Receptacles, Female Sockets | |
Manufacturer | TE Connectivity AMP Connectors | |
Series | AMPMODU | |
Packaging | Tray | |
Part Status | Obsolete | |
Connector Type | Receptacle | |
Number of Positions | 18 | |
Number of Positions Loaded | All | |
Pitch | 0.079" (2.00mm) | |
Number of Rows | 2 | |
Row Spacing | 0.079" (2.00mm) | |
Height Stacking (Mating) | - | |
Height Above Board | 0.177" (4.50mm) | |
Mounting Type | Through Hole | |
Termination | Solder | |
Contact Finish | Gold | |
Contact Finish Thickness | 8µin (0.20µm) | |
Features | - | |
Color | Black | |
Standard Package | 11,520 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | 3-1470209-2 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
3-1470209-2 is in stock for immediate shipping now. We are the distributor of TE Connectivity Potter & Brumfield Relays all series components. The condition of 3-1470209-2 is new and unused, you can buy 3-1470209-2 TE Connectivity Potter & Brumfield Relays with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 3-1470209-2.
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