Manufacturer Part Number: | 2-216792-0 |
---|---|
Manufacturer: | TE Connectivity Potter & Brumfield Relays |
Product Category: | Rectangular Connectors - Board In, Direct Wire to Board |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | 20 Position Ribbon Cable, DIP Header Connector Gray IDC Through Hole, Press-Fit |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | 2-216792-0 Datasheet |
Internal Part Number | 898-2-216792-0 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Connectors, Interconnects | |
Family | Rectangular Connectors - Board In, Direct Wire to Board | |
Manufacturer | TE Connectivity AMP Connectors | |
Series | AMP-Latch | |
Packaging | Tape & Reel (TR) | |
Part Status | Active | |
Connector Type | Ribbon Cable, DIP Header | |
Number of Positions | 20 | |
Cable Pitch | 0.050" (1.27mm) | |
Board-Side Pitch | 0.100" (2.54mm) | |
Number of Rows | 2 | |
Row Spacing | 0.100" (2.54mm) | |
Mounting Type | Through Hole, Press-Fit | |
Cable Termination | IDC | |
Wire Gauge | - | |
Features | Feed Through | |
Contact Finish | Tin | |
Contact Finish Thickness | 118.1µin (3.00µm) | |
Color | Gray | |
Number of Positions Loaded | All | |
Standard Package | 1,500 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | 2-216792-0 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
2-216792-0 is in stock for immediate shipping now. We are the distributor of TE Connectivity Potter & Brumfield Relays all series components. The condition of 2-216792-0 is new and unused, you can buy 2-216792-0 TE Connectivity Potter & Brumfield Relays with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 2-216792-0.
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