Manufacturer Part Number: | 2-176314-4 |
---|---|
Manufacturer: | TE Connectivity Potter & Brumfield Relays |
Product Category: | Rectangular - Board to Board Connectors - Headers, Male Pins |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | CONN HEADER 24POS DUAL VERT TIN |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | Obsolete / Discontinued |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | 2-176314-4 Datasheet |
Internal Part Number | 898-2-176314-4 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
3D Model | 2-176314-4.pdf | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Headers, Male Pins | |
Manufacturer | TE Connectivity AMP Connectors | |
Series | FP | |
Packaging | Tube | |
Part Status | Obsolete | |
Connector Type | Shrouded | |
Number of Positions | 24 | |
Number of Positions Loaded | All | |
Pitch | 0.049" (1.25mm) | |
Number of Rows | 2 | |
Row Spacing | 0.049" (1.25mm) | |
Height Stacking (Mating) | - | |
Molding Height Above Board | 0.348" (8.85mm) | |
Contact Mating Length | - | |
Mounting Type | Surface Mount | |
Termination | Solder | |
Contact Finish | Tin | |
Contact Finish Thickness | 31.5µin (0.80µm) | |
Features | Board Guide | |
Color | Black | |
Standard Package | 25 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | 2-176314-4 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
2-176314-4 is in stock for immediate shipping now. We are the distributor of TE Connectivity Potter & Brumfield Relays all series components. The condition of 2-176314-4 is new and unused, you can buy 2-176314-4 TE Connectivity Potter & Brumfield Relays with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 2-176314-4.
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