Manufacturer Part Number: | 146499-4 |
---|---|
Manufacturer: | TE Connectivity Potter & Brumfield Relays |
Product Category: | Rectangular - Board to Board Connectors - Board Spacers, Stackers |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | 8 Position Header Spacer Connector 0.100" (2.54mm) Tin-Lead Through Hole |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | 146499-4 Datasheet |
Internal Part Number | 898-146499-4 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Board Spacers, Stackers | |
Manufacturer | TE Connectivity AMP Connectors | |
Series | AMPMODU Mod II | |
Packaging | Bulk | |
Part Status | Active | |
Number of Positions | 8 | |
Pitch | 0.100" (2.54mm) | |
Number of Rows | 2 | |
Row Spacing | 0.100" (2.54mm) | |
Length - Overall | 1.130" (28.70mm) | |
Length - Post (Mating) | 0.120" (3.05mm) | |
Length - Stack Height | 0.900" (22.86mm) | |
Length - Tail | 0.110" (2.79mm) | |
Mounting Type | Through Hole | |
Termination | Solder | |
Contact Finish - Post (Mating) | Tin-Lead | |
Contact Finish Thickness - Post (Mating) | 100µin (2.54µm) | |
Color | Black | |
Standard Package | 150 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | 146499-4 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
146499-4 is in stock for immediate shipping now. We are the distributor of TE Connectivity Potter & Brumfield Relays all series components. The condition of 146499-4 is new and unused, you can buy 146499-4 TE Connectivity Potter & Brumfield Relays with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for 146499-4.
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