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117-93-668-41-005000

117-93-668-41-005000
Manufacturer Part Number:117-93-668-41-005000
Manufacturer:
Product Category:Sockets for ICs, Transistors
Available Quantity:9016 Pieces
Unit Price:Quote by Email
Description:CONN IC DIP SOCKET 68POS GOLD
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: 117-93-668-41-005000 Datasheet
117-93-668-41-005000´s Parameters
Internal Part Number898-117-93-668-41-005000
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
CategoryConnectors, Interconnects
FamilySockets for ICs, Transistors
ManufacturerMill-Max Manufacturing Corp.
Series117
PackagingTube
Part StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)68 (2 x 34)
Pitch - Mating0.070" (1.78mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.070" (1.78mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post200µin (5.08µm)
Contact Material - PostBrass Alloy
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature-55°C ~ 125°C
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
Current Rating3A
Contact Resistance-
Standard Package 8
Weight0.001 KG
ApplicationEmail for details
Replacement Part117-93-668-41-005000
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

117-93-668-41-005000 is in stock for immediate shipping now. We are the distributor of Mill-Max Manufacturing Corp. all series components. The condition of 117-93-668-41-005000 is new and unused, you can buy 117-93-668-41-005000 Mill-Max Manufacturing Corp. with us at a very low price and quick delivery.

Please kindly send us an email if you have any demands for 117-93-668-41-005000.

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