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116-93-306-41-003000

116-93-306-41-003000
Manufacturer Part Number:116-93-306-41-003000
Manufacturer:
Product Category:Sockets for ICs, Transistors
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:CONN IC DIP SOCKET 6POS GOLD
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: 116-93-306-41-003000 Datasheet
116-93-306-41-003000´s Parameters
Internal Part Number898-116-93-306-41-003000
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
CategoryConnectors, Interconnects
FamilySockets for ICs, Transistors
ManufacturerMill-Max Manufacturing Corp.
Series116
PackagingTube
Part StatusActive
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)6 (2 x 3)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesElevated, Open Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post200µin (5.08µm)
Contact Material - PostBrass Alloy
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature-55°C ~ 125°C
Termination Post Length0.108" (2.74mm)
Material Flammability Rating-
Current Rating3A
Contact Resistance-
Standard Package 67
Weight0.001 KG
ApplicationEmail for details
Replacement Part116-93-306-41-003000
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

116-93-306-41-003000 is in stock for immediate shipping now. We are the distributor of Mill-Max Manufacturing Corp. all series components. The condition of 116-93-306-41-003000 is new and unused, you can buy 116-93-306-41-003000 Mill-Max Manufacturing Corp. with us at a very low price and quick delivery.

Please kindly send us an email if you have any demands for 116-93-306-41-003000.

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