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110-99-304-41-001000

110-99-304-41-001000
Manufacturer Part Number:110-99-304-41-001000
Manufacturer:
Product Category:Sockets for ICs, Transistors
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:CONN IC DIP SOCKET 4POS TIN-LEAD
Lead Free Status / RoHS Status:Contains lead / RoHS non-compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: 110-99-304-41-001000 Datasheet
110-99-304-41-001000´s Parameters
Internal Part Number898-110-99-304-41-001000
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
CategoryConnectors, Interconnects
FamilySockets for ICs, Transistors
ManufacturerMill-Max Manufacturing Corp.
Series110
PackagingTube
Part StatusActive
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)4 (2 x 2)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingTin-Lead
Contact Finish Thickness - Mating200µin (5.08µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post200µin (5.08µm)
Contact Material - PostBrass Alloy
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature-55°C ~ 125°C
Termination Post Length0.125" (3.18mm)
Material Flammability Rating-
Current Rating3A
Contact Resistance-
Standard Package 102
Weight0.001 KG
ApplicationEmail for details
Replacement Part110-99-304-41-001000
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

110-99-304-41-001000 is in stock for immediate shipping now. We are the distributor of Mill-Max Manufacturing Corp. all series components. The condition of 110-99-304-41-001000 is new and unused, you can buy 110-99-304-41-001000 Mill-Max Manufacturing Corp. with us at a very low price and quick delivery.

Please kindly send us an email if you have any demands for 110-99-304-41-001000.

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