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1-1825276-2

1-1825276-2
Manufacturer Part Number:1-1825276-2
Manufacturer:
Product Category:Sockets for ICs, Transistors
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:CONN IC DIP SOCKET 32POS GOLD
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: 1-1825276-2 Datasheet
1-1825276-2´s Parameters
Internal Part Number898-1-1825276-2
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
RoHS Information1-1825276-2 Statement of Compliance
RoHS 2 Statement
3D Model1-1825276-2.pdf
CategoryConnectors, Interconnects
FamilySockets for ICs, Transistors
ManufacturerTE Connectivity AMP Connectors
SeriesDiplomate DL
PackagingTube
Part StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)32 (2 x 16)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30µin (0.76µm)
Contact Material - MatingBeryllium Copper
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostGold
Contact Finish Thickness - Post30µin (0.76µm)
Contact Material - PostBeryllium Copper
Housing MaterialThermoplastic, Glass Filled
Operating Temperature-55°C ~ 125°C
Termination Post Length0.128" (3.24mm)
Material Flammability RatingUL94 V-0
Current Rating-
Contact Resistance30 mOhm
Standard Package 1,300
Weight0.001 KG
ApplicationEmail for details
Replacement Part1-1825276-2
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

1-1825276-2 is in stock for immediate shipping now. We are the distributor of TE Connectivity Potter & Brumfield Relays all series components. The condition of 1-1825276-2 is new and unused, you can buy 1-1825276-2 TE Connectivity Potter & Brumfield Relays with us at a very low price and quick delivery.

Please kindly send us an email if you have any demands for 1-1825276-2.

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